Program Details

1. Tailored Education Program

• A global learning environment, including overseas rotational assignments (18–24 months).
• Professional technical and corporate culture training leveraging STATS ChipPAC’s global network.

2. Learning and Development Support

• Coaching: Expert coaching to enhance individual competencies.
• Mentoring: Dedicated mentoring from experienced professionals.
• Peer Learning: Knowledge sharing and teamwork-driven collaboration.
• HR Support: Systematic career development and growth opportunities.

3. Practical, Hands-on Learning

• Collaborate with semiconductor packaging experts through domestic and international assignments.
• Gain real-world problem-solving experience by participating in diverse team projects.

Eligibility

• Fields of Study: Semiconductor Packaging, Chemical Engineering, Mechanical Engineering, and other related fields.
• Academic Requirements: Master’s or Doctoral degree holders (including expected graduates).
• Additional Qualifications:
• Willingness to participate in overseas rotational assignments.
• Strong teamwork and problem-solving skills.
• Proficiency in global communication.