We are looking for a motivated Research & Technical Support Engineer/Scientist to develop, maintain, and support BEOL furnace processes including BEOL metal anneal, barrier/liner engineering, dielectric curing, hydrogen anneals, and stress‑relief treatments. This role involves both fundamental materials science and hands‑on tool/process ownership in a cleanroom research environment. You will collaborate with R&D teams working on advanced interconnect technologies, photonic integration, 3D integration, and novel dielectric/metallization schemes.

Job Responsibilities:

BEOL Furnace Process Development

• Develop and optimize BEOL thermal processes including Metal anneal, Barrier/liner stabilization, Dielectric curing, Passivation and Stress‑relief anneals
• Perform tool qualification, recipe loading, chamber matching, SPC set up and contamination monitoring.
• Troubleshoot process excursions and ensure stable operations with high repeatability.
• Correlates anneal conditions with film quality, stress, adhesion, and reliability metrics.

Cross‑Functional Collaboration

• Work closely with teams in Photonic IC, Wide-Bandgap Devices, Packaging and reliability for process integration.
• Provide guidance for internal projects on thermal budgets, thermal‑stress implications, and BEOL process compatibility for novel materials and device architectures.

Job Requirements:

• Degree (Bachelor, or Master based on job scope) or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
• 3 years of working experience in Semiconductor Fabrication is advantageous.
• Hands‑on experience with furnace processing, anneals, or BEOL‑related thermal steps is highly wanted.
• Knowledge of metallization physics, anneal passivation, interconnect reliability and dielectric curing.
• Understanding of thermal budget constraints and stress‑management in BEOL stacks.
• Hands-on experience in Design of Experiments (DOE), root cause analysis, and problem-solving methods is desired.
• Experience in Photonic IC, SiC devices, 2.5D/3D packaging and/or Wafer Bonding would be a plus.
• Proficiency with materials characterization tools, such as ellipsometry, XRD, XPS, TEM, SEM, stress measurement