The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
• Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
• Lead capability development projects with manageable risks and mentor less experienced colleagues.
• Collaborate with senior staff and principal investigators to develop process capability and new.
• Inspire and mentor talent in semiconductor technology, contributing to workforce development in the field.

Qualifications and Skills

Candidates should meet the following criteria:

• Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
• Technical Expertise: Hands-on experience in flip chip bonding is preferable
• Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.

What We Offer

• The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
• A collaborative and interdisciplinary work environment.
• Access to state-of-the-art facilities and resources.

Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today!