As part of National Semiconductor Translation and Innovation Center (NSTIC), the candidate will be involved in the development of heterogeneous integration process for realizing multi-functional photonic devices. The candidate will be involved in various back-end-of-line (BEOL) process modules, such as chemical and plasma-based cleaning, chemical mechanical polishing (CMP), dicing, backgrinding, and die-to-wafer bonding.

The candidate will work closely with people of diverse expertise.

Job Responsibilities:

• Develop, design, and optimize die-to-wafer bonding process employing III-V semiconductor material, Lithium Niobate on Insulator (LNOI), and Si-based material platforms. 
• Design of experiments (DOE) for various Die-to-Wafer (D2W) bonding methodologies.
• Liaise between design, fabrication, and testing teams to ensure smooth process integration and device fabrication.
• Metrology, data analysis, and documentation
• Present and discuss experimental data to the team

Job Requirements:

• Degree in Electronics Engineering, Microelectronics, Physics, Chemistry, or equivalent.
• Experience in semiconductor industry is preferred, particularly with wafer-to-wafer and die-to-wafer bonding process.
• Good critical thinking and problem-solving ability.
• Able to work with cross-functional team, with good communication/presentation skill.
• Able to work in a fast-paced and collaborative environment

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.