Responsibilities:

• Develop and optimize processes for SiC Device module integration, flows for SiC devices fabrication, focusing on process integration and yield improvement.
• Collaborate with cross-functional teams to design and implement process modules for SiC devices manufacturing.
• Conduct experiments, analyze data and refine processes to achieve targeted performance and yield.
• Troubleshoot and resolve issues related to device integration and process development.
• Document procedures, maintain details record, and standard operating procedures (SOP)

Job Requirement:

• Diploma, Bachelor’s or Master’s in Electronics Engineering, Materials Science, Physics, or related field.
• Proven experience (1-2 years) in semiconductor device module integration.
• Familiarity with cleanroom protocols and safety procedures.
• Knowledge of basic semiconductor unit processes such as PVD, RIE, ICP, etc.
• Ability to work effectively as a team as well as independently.
• Intern/working experience in semiconductor manufacturing/R&D Fab will be considered a plus.
• Strong communication and teamwork skills.