Key Responsibilities

• Process Development: Optimize recipes for CMP/Lithography/Plating/Coating.

• Equipment Ownership: Define specifications and validate tools; monitor slurry delivery, exposure uniformity, and plating chemistry.

• Yield & Quality: Lead root-cause analysis for defects like dishing (CMP), undercut (Litho), voiding (Plating), and delamination (Coating).

• Metrology & Analysis: Utilize CD-SEM, ellipsometry, and profilometry; execute DOE and SPC to stabilize critical process parameters.

• Integration: Collaborate across modules to ensure seamless layer-to-layer transition and support New Product Introduction (NPI).

Job Requirements

Education: Bachelor's/Master’s/PhD in Materials Science, Chemical/Mechanical Engineering, or related field.

Experience: 3+ years in semiconductor packaging or substrate manufacturing with hands-on expertise in at least two of the four core modules.

Technical Skills: Deep knowledge of SAP/mSAP, ABF build-up, and PID technologies.

Problem Solving: Strong analytical skills (8D, Fishbone) and experience with defect inspection tools (SEM, AFM).

If you are interested in the position , kindly send your CVs in to jasper.soh(@)randstad.com.sg.

Please include your availability, expected salary and reason for leaving your current job

We regret that only shortlisted candidates will be contacted.

EA: 94C3609 / Reg: R25154228