Principal/Senior Engineer Package Characterization, APTD
Principal/Senior Engineer Package Characterization, APTD
Job Details
Vacancies
1 position
Experience Required
No experience required
Job Description
As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.
Responsibilities and Tasks
Conduct Electrical Characterization
Understand PFA techniques available for de-processing failures
Understand assembly and test process
Perform electrical verification to confirm failures
Establish best known method for de-processing package
Provide Data Analysis
Understand backend test flows, qualification methodologies and be able to pull relevant information
Communicate with Internal/External Groups
Document failure analysis techniques used to isolate failure for other groups
Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
Provide Technical Expertise
Conduct TMO training and FA certification
Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.
Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.
Maintain Equipment
Coordinate calibrations (external to Micron)
Procure parts as needed
Coordinate host vendors to support equipment repair
Manage Laboratory
Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.
Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.
To manage the exhaust and scrubber systems of the FA Lab.
To maintain records and procedures as per Micron GOPs
Education and Experience
PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline.
4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.
Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.
Strong communication skills with the ability to collaborate effectively across internal teams and external partners.
A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.
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