Job Highlights

• Yishun

• 0800 - 1730 / 2315 – 0800 (Monday to Friday)

• Up to $2,200 (Basic)

• Renewable and Convertible

Job Responsibilities

• Assemble and debug precision semiconductor mold tooling according to engineering specifications and quality standards.

• Perform root-cause analysis and troubleshooting for encapsulation and molding process issues.

• Conduct tooling adjustments, fine-tuning, and optimization to achieve required performance and dimensional accuracy.

• Verify assembly quality using precision measurement tools and ensure adherence to critical-to-function dimensions.

• Collaborate with engineering, production, and quality teams to resolve technical issues and support continuous improvement initiatives.

• Maintain accurate documentation of assembly procedures, test results, and tooling modifications.

• Ensure compliance with safety standards, 5S practices, and operational procedures.

Job Requirements

• Minimum Nitec in Mechanical Engineering, Precision Engineering, or related disciplines.

• Prior experience in precision tooling assembly, mold tooling, or semiconductor encapsulation processes.

• Strong attention to detail with good analytical and problem-solving skills.

• Able to work independently with minimal supervision and collaborate effectively in a team.

Applicants who possess relevant experience for the above responsibilities are most welcome to apply. If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

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Kuan Mei Yang

Registration Number: R24124509

EA License No: 06C2859 (MCI Career Services Pte Ltd)