Main Responsibilities

• Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions.

• Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows.

• Align device and process requirements with customers through technical discussions and solution deep dives.

• Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration.

• Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases.

We’re looking for someone with:

• A bachelor’s degree in Electronics, Electrical Engineering, Physics, Materials Engineering, or a related field.

• At least 3 years of hands-on experience in Silicon Photonics (SiPh) R&D, process integration, or related areas.

• A strong background in SiPh process development, photonic IC packaging, optical device design, or characterization.

• Familiarity with foundry environments, including integration or module-level responsibilities.

• Proficiency in DOE, FMEA, control planning, and data-driven problem-solving.

• Excellent communication skills with the ability to collaborate effectively across teams and with external partners.

• A self-driven, curious mindset with a passion for innovation and continuous improvement.