Position Summary
The Technical Program Specialist is responsible for overall management of customers’ technical projects and related matters.
Candidates with wafer bumping, WLCSP, or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• Works with account management and customer service teams in all technical aspects of the customers’ engagements
• Provides technical support to sales team to gain market share and improve customer’s profitability status.
• Communicates new customer technology requirements to the internal teams. Communicates and manage all customer process and package roadmap strategies.
• Coordinates factory/customer technical projects and act as the point of contact for new quality/reliability programs.
• Implements change notices and resolves technical issues.
• Prepares and participates in audits and factory visits with customers.
• Other ad-hoc activities assigned by the management.

Requirements

• At least a Bachelor’s Degree in any engineering discipline.
• At least 2 - 3 years of relevant working experience in the assembly process of the back end of semiconductor production.
• Possess good knowledge and hands-on experience in assembly processes especially in wafer-level packaging like wafer bumping, eWLB or other wafer-level Fanout Packaging.
• Knowledge on DOE, reliability requirements, material selection, FMEA, Failure Analysis and other quality and statistical tools.
• Self-driven and has excellent problem resolution and organizational skills for daily customer support and managing on-going and future programs.
• Has initiative and demonstrate excellent follow-up on active programs with multiple customers.
• Able to communicate and present effectively in small and large groups.
• Able to work independently and as a team player with customers and cross-functional teams within the organization.
• Familiarity with SAP or other ERP systems is an added advantage.
• Able and willing to travel as needed.