Responsibilities:

• Prioritize and manage issues with cross-functional teams (Customer Service, R&D, Quality, Product Line).
• Identify key field issues and provide feedback to improve product performance and customer satisfaction.
• Offer technical guidance and remote support to Field Service Engineers (FSEs) for troubleshooting.
• Act as 2nd level support for technical and quality issues on assigned machine platforms.
• Use JIRA to manage issue resolution and meet SLA requirements.
• Participate in knowledge transfer and apply field learnings to enhance technical expertise.
• Own at least one machine platform and serve as backup for another.
• Support the Support Centre Manager in achieving department KPIs.
• Perform root cause analysis and implement preventive measures to reduce recurring issues.
• Stay current with industry trends and advancements in semiconductor equipment.

Requirements:

• Bachelor’s/Master’s in Electronics, Electrical or Mechatronics Engineering.
• 5+ years in Die attach process/application on a specific machine platform, project management experience.
• Analytical, proactive, detail-oriented, strong communicator, accountable, team player, works under pressure.
• AI platform proficiency; safety-conscious; willing to travel as needed.
• Experienced in MS-Office and JIRA are preferred.

Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [email protected]

EA License No: 13C6305

Reg. No.: R24121656 (CHEN JING WEI)

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