Job Responsibilities:

• 2.5D/3DIC platform development.
• New unit module development and devices development.
• New process verification and qualification.
• New platform DSM setup
• Customer engagement and new product verification

Capability

• Solid semiconductor process integration and device characterization skills
• Semiconductor device physics and analysis skill.
• Experienced in 2.5D and 3DIC process development are plus.
• Skill on FMEA, control plan, DOE (design of experiment) and problem solving.
• Good communication, self-motived and avid learner

Qualification

• At least bachelor degree in microelectronics/electronics/electrical/physics/Materials engineering or other relevant fields.
• At least 3 years working experience in semiconductor R&D or related foundry experience of integration/process/device engineer.
• Working experience: 2.5D and 3DIC integration and device background are plus.
• Proficient English oral and writing skill.