Responsibilities:

• New Device Introduction: Perform tape-out/tooling operations for customer design database and achieve the goal of first pilot success.
• Project coordination: Customer interface and cross department coordination with seamless communications.
• Manage conference calls, meetings and customer visits with professional presentation skills and logistics arrangement for project success.
• Project management: Documentation, summary, meeting minutes and ability to recap keynote of meetings for management team review.

Requirements:

• MS or Bachelor degree in Electrical engineering or relevant.
• At least 5 years of fab working experience and process integration engineering background is preferable.
• Good knowledge in wafer process flow, semiconductor device physics, wafer foundry service flow.
• Strong in problem solving and project management skills.
• Excellent personality, good interpersonal skills, self-motivated, well-organized and able to perform under pressure.