Purpose of the Job

• To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.

Key Job Accountabilities:

• Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
• Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
• Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
• Track the consumption of critical components and suggest improvements for part lifetime extension.
• Maintain detailed logs of equipment history, repair procedures, and safety checklists.

Required Experience and Qualifications

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field.
• Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
• Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
• Comfort working in a cleanroom environment and flexibility for shift rotations.