Position Summary

The Senior/ Package Designer is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• With reference to internal design guidelines, work with the internal & external customer to:
• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
• Generate test vehicle design and the related PCB design.
• Prepare design risk assessment report.
• Generate reticle and stencil design.
• Generate other schematics or drawing as requested.

• Review, maintenance and update the design guidelines.
• Manage the conversion of internal design into suppliers’ final design.
• Document all the drawing revisions and change records.
• Support audits
• Any other ad-hoc duties as assigned

Requirements

• Minimum Bachelor's Degree or Master’s Degree in electrical engineering or similar discipline
• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability
• Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will bean advantage
• Hands-on skills on design software tools like Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors
• Experience with PCB test board design
• Fresh graduates are welcome to apply