Responsibilities

• Lead NPI team in design reviews, feasibility builds, characterization, and qualification

• Support customer builds and liaise with customers, TPMs, and PTMs

• Drive technology transfer from R&D to Operations

• Lead process optimization and improvements in eWLB technology

• Perform risk assessments, FMEA, and DOE for new products

• Coordinate cross-functional teams for new product startup and ensure smooth, excursion-free ramp

• Resolve issues from engineering builds and oversee documentation (eNPI/qualification reports)

• Support customer engagements and fab visits

• Set and track KPIs to ensure timely delivery and successful qualification

• Train team in statistical process characterization methods

Requirements

• Degree (B.Eng/B.Sc/M.Eng/M.Sc/PhD) in Engineering, Physics, Materials Science, or equivalent

• ≥5 years in Wafer Fab or Wafer Bump

• ≥3 years in a management role

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 5WY53653