Summary

•To lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.

Job•          Develop and optimize electroplating, seed etching, and PR stripping processes

•          Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation

•          Evaluate and introduce new materials and equipment for plating/etching process integration

•          Conduct pre-production process validation and yield stabilization

•          Perform DOE planning and analyze experimental data using statistical tools (e.g., SPC, Minitab, JMP)

•          Develop customized processes and provide technical support for customer programs

•          Set up equipment and optimize operating conditions in coordination with vendors

•          Troubleshoot quality issues across plating and etching processes

•          Support development of advanced packaging technologies including 2.5D, fan-out,and SiP

•          Supports high-volume semiconductor packaging processes in plating and etching

•          Contributes directly to process yield, quality improvement, and customer technical satisfaction

•          Drives technical innovation in advanced packaging technologies in alignment with global customer programs

Requirement

•          Bachelor’s degree or higher in Engineering or Science (e.g., Materials Science,Chemistry, Chemical Engineering, Electronics, Advanced Materials)

•          Minimum 3 years of hands-on experience in plating, etching, or stripping processes in semiconductor manufacturing

•          Fundamental understanding of advanced semiconductor fabrication and integration processes

•          Strong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reporting

•          Proficiency in preparing technical documentation and delivering presentations

•          Basic knowledge of semiconductor process equipment and materials

•          Experience in key back-end processes such as TSV, RDL, and micro bump

•          Knowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chip

•          Familiarity with related processes such as photo, chip attach, and underfill

•          Proven experience in joint development projects with global customers

•          Hands-on collaboration with material or equipment suppliers for co-evaluation or integration

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1)Current Drawn

2)Expecting Salary

3)Date Available

4)Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 93R5X694