Job Summary

To develop and optimize AOI and reflow process technologies ensuring stable mass production and high product quality in advanced packaging lines, while supporting customer and internal quality requirements.

Responsibilities

• Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes to enhance defect detection accuracy
• Operate and optimize 2D/3D AOI systems and inspection parameters to improve inspection efficiency and product quality
• Configure AOI inspection algorithms for new product designs to meet evolving production needs
• Set up process conditions and equipment configurations for new packages and production lines to ensure smooth manufacturing transitions
• Optimize reflow parameters and temperature profiles to achieve consistent soldering quality
• Analyze solder and micro bump quality and implement process improvements to reduce defects
• Conduct root cause analysis for process issues and implement corrective actions to maintain process stability
• Support customer quality requirements through technical evaluation and documentation to ensure compliance
• Support mass production and quality control in advanced semiconductor packaging processes to drive yield improvements
• Contribute to defect reduction, process stability, and customer satisfaction by applying quality tools and methodologies
• Drive yield and reliability improvements in AOI and reflow process areas through continuous process optimization

Required competencies and certifications

• Bachelor’s degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics)
• Minimum 3 years of experience in AOI or reflow process in semiconductor backend manufacturing
• Ability to establish process conditions and optimize parameters for AOI and reflow processes
• Strong data analysis and problem-solving skills applied to process optimization and defect reduction
• Knowledge of inspection or reflow/soldering principles relevant to semiconductor packaging
• Experience in defect analysis and developing defect evaluation criteria for AOI inspection
• Familiarity with quality tools such as APQP, FMEA, and 8D methodology for quality control and problem solving
• Hands-on experience with major AOI equipment (e.g., KLA, Onto, Camtek)
• Collaborative experience in AOI image analysis and algorithm development
• Understanding of associated assembly/joining processes (e.g., bonding, chip attach)

All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job

We regret that only shortlisted candidates will be notified.
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
www.peopleprofilers.com
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID: 5WYXW433