• The project manager is coordinating mainly hardware, software & process related projects with the focus on a continuous improvement of Die bonder machines especially in context with performance improvement, cost reduction and functionality enhancement.
• In this function he/she is managing projects and sub projects according to the Die Attach Project development Process (FLEX) by considering of proven methods, risk management and standards (Semi S2, Semi S8, CE).
• He/she is responsible for project planning and periodical controlling of targets, risks, milestones, costs and resources. In addition he/she performs project & review meetings and creates periodical reports for the steering committee and other stakeholders involved in the project.
• He/she is coordinating the information flow within the project, to the project owner, to external participants and to the production sites in Asia.
• In his/her role as sub project manager he/she is the interface for project coordination between the different Rnd locations within and also responsible for the series introduction of projects started from other Rnd sites.

Education

• Minimal bachelor degree from Mechatronic, Electrical or Automation.

Work experience

• Minimum 2 years work experience, prefer in semiconductor back end with experience in project management.