• Responsible for the design and implementation of packaging processes for new isolation products.

• Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.

• Conduct Design of Experiments (DOE) and optimize newly developed processes.

• Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.

• Perform process yield analysis and failure investigations for new device-related issues.

• Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.

Requirement:

• We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.

• Strong background in Mechanical Engineering and semiconductor packaging process development.

• Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.

• Demonstrated analytical and critical thinking skills with strong problem-solving capabilities and a solution-oriented mindset.

• Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.

• Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.

• Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch is an advantage.

• Experience in Solidworks/ Ansys, CAD and simulation tools