ST Engineering is a global technology, defence and engineering group with offices across Asia, Europe, the Middle East and the U.S., serving customers in more than 100 countries. The Group uses technology and innovation to solve real-world problems and improve lives through its diverse portfolio of businesses across the aerospace, smart city, defence and public security segments. Headquartered in Singapore, ST Engineering ranks among the largest companies listed on the Singapore Exchange.

Join our Cyber Team

We are an industry leader in cybersecurity with over two decades of experience, we deliver a holistic suite of trusted cybersecurity solutions to empower cyber resilience for government and ministries, critical infrastructure, and commercial enterprises. Backed by our indigenous capabilities and deep domain expertise, we offer robust cyber-secure products and services in cryptography, cybersecurity engineering, digital authentication, SCADA protection, audit and compliance. We specialise in the design and build of security operations centres for cybersecurity professionals and provide managed security services to strengthen the cybersecurity posture of our government and enterprisecustomers.

Join a team of hard-core designers and engineers who conceptualize and deliver secure electronic products from the ground up. We are seeking a highly experienced Principal Mechanical Engineer to serve as the technical authority for mechanical design and electronics packaging. In this role, you will lead the design, development, and validation of mechanical enclosures and chassis for our high‑performance security products built with advanced digital and analog circuits.

You should be deeply conversant with electronics packaging at the PCB, module, chassis, and rack levels, and highly skilled in mechanical and thermal design for complex electronic systems, with strong leadership in driving engineering solutions from concept to production.

You will collaborate closely with multi disciplinary teams, guide junior engineers, and work with external manufacturing partners to deliver robust, reliable, and manufacturable solutions.

Key Responsibilities

Mechanical & Thermal Design Leadership

• Lead the design and development of mechanical chassis, enclosures, and casing for our products.
• Oversee thermal analysis, simulation, and validation for natural/forced convection and liquid‑cooled systems.
• Review and approve material selection for electronics packaging to ensure performance, reliability, and manufacturability.
• Drive thermal solution qualification, including test planning, execution, and analysis.

Technical Authority & Documentation

• Produce and review design specifications, engineering drawings, and test documentation.
• Ensure compliance with mechanical design standards, manufacturing constraints, and internal quality processes.
• Conduct and lead design reviews for mechanical and thermal systems.

Cross‑Functional& Vendor Collaboration

• Work closely with electrical, firmware, and manufacturing teams throughout the product development lifecycle.
• Engage external vendors, contractors, and suppliers to ensure high‑quality mechanical components and thermal solutions.
• Support production subcontractors and resolve mass‑production issues through root‑cause analysis and corrective action.

Innovation, Optimization & Problem‑Solving

• Evaluate new materials, manufacturing methods, and thermal technologies to enhance product reliability and performance.
• Provide mentorship and technical guidance to junior engineers and designers.
• Drive continuous improvement initiatives in mechanical design, packaging, and thermal management.

Requirements

Experience

• Minimum 10 years of relevant experience in electronics packaging, mechanical design, and thermal analysis.
• Proven track record in designing enclosures for electronics products spanning PCB, module, chassis, and rack‑level packaging.

Technical Competencies

• Deep proficiency with at least:
• One mechanical design and 3D modelling tool (e.g. SolidWorks, Creo, Inventor).
• One thermal design and analysis tool (e.g. Icepak, Flotherm).
• Strong expertise in thermal design: natural convection, forced convection, and liquid‑cooled systems.
• Skilled in evaluating and selecting heat sinks, TIMs, heat spreaders, and packaging materials.
• Familiarity with multi‑layer PCB design and standard semiconductor package types.
• Strong understanding of mechanical design standards, tolerances, and manufacturing constraints (machining, sheet metal, plastics, casting, etc.).

Soft Skills

• Strong technical leadership with the ability to influence design decisions and guide teams.
• Excellent communication and cross-functional collaboration skills.
• Highly analytical, structured, and detail-oriented.
• Ability to manage multiple complex projects simultaneously.

Good-to-have

Experience in any of the following areas is a plus:

• Industrial design
• PCB layout design
• Circuit design
• EMC/ESD considerations in enclosure design
• Ruggedized or high‑reliability electronics packaging
• Defence, security, or high‑performance electronics industries

Work Location: near Marymount MRT

Find out more:  https://www.stengg.com/cybersecurity

ST Engineering believes in fostering a culture where team members are encouraged to overcome challenges, explore new ideas, and work together to succeed. We value individuals who are determined to push beyond the boundaries, and have athirst for knowledge, continuous learning, and self-improvement.