Responsibilities (Actual daily deliverables):

·       Oversee the Process Engineering Section for Taping, BG, Wafer-mount, de-taping, LG, SAW and Automatic Optical Inspection (AOI) & TNR operations.

·       Provide technical leadership for engineers to control, sustain and to continuously drive improvement for yield, quality and cycle time.

·       Establishing partnership and work with upstream processes such as Bumping to improve quality and yield performance.

·       Establish and improve controls to ensure all products meet customers’ requirements in terms of quality and yield.

·       Support on engagement with customers on improvement of process, material and equipment capabilities.

·       Lead cross-functional teams such as production and equipment for out-of-control situations and provide decision on lot disposition.

·       Continuously improve the yield of qualified products through systematic data analysis.

·       Productivity improvement through process redesign to maximize productivity of both equipment and processes.

Required Experience and Qualifications (Required knowledge, skills andexperience---however acquired):

·       Minimum 10 years in managerial/leadrole in fast moving semiconductor industry.

·       Engineering degree from recognizedUniversity.

·       Strong in process engineering inareas of Taping,BG, Wafer-mount, detaping, LG, SAW and Automatic Optical Inspection (AOI) &TNR operation for bare dies.

·       Able to provide technical leadershipto a team of engineers for customer issues, yield improvement programs andprocess development activities.

·       Ability to interface directly withcustomers in addressing quality issues, new product introduction and continuousimprovement programs.

·       Strong knowledge in JMP, 8D, FMEA, DOE and Systematic Problem-solving.