Job Responsibilities

Process Development

• Develop and optimize plating processes (e.g., electrolytic copper, Ni/Sn).
• Evaluate new chemicals, materials, and equipment for plating process enhancement.
• Establish plating parameters to ensure uniform thickness, adhesion, and reliability.

Process Control & Monitoring

• Monitor plating bath chemistry and maintain proper control limits.
• Implement Statistical Process Control (SPC) and DOE to analyze process capability.
• Troubleshoot process and equipment issues to improve yield and throughput.

Yield & Quality Improvement

• Conduct root cause analysis of plating defects.
• Work with quality and reliability teams to address substrate failure mechanisms.
• Drive continuous improvement initiatives to enhance quality and cost efficiency.

Cross-Functional Collaboration

• Interface with design, manufacturing, equipment, and suppliers to meet production goals.
• Support new product introductions (NPI) and qualification of plating processes.

Documentation & Compliance

• Maintain detailed documentation of plating recipes, process controls, and specs.
• Ensure compliance with environmental, safety, and regulatory standards (e.g., RoHS, REACH).

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications:

• PhD or Master’s degree in Chemical Engineering, Materials Science, or related field.
• 5–10+ years of experience in semiconductor packaging or PCB/substrate manufacturing.
• Hands-on experience with copper/nickel/tin plating processes.
• Familiarity with tools such as XRF, SEM, profilometer, and electroplating equipment.
• Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.

Specialized Knowledge & Skills:

• Strong analytical and problem-solving skills.
• Knowledge of surface treatment, adhesion promotion, and via filling techniques.
• Familiar with lean manufacturing, Six Sigma, or SPC tools.
• Excellent communication and teamwork abilities.