Position Summary

Package Design Manager (BGA & Substrate & WLCSP) is responsible for management of product and tooling design.

Candidates with management of wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Key Responsibilities

• Lead packaging design team.
• With reference to internal design guidelines, work with the internal & external customer to:
• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
• Generate test vehicle design and the related PCB design.
• Prepare design risk assessment report.
• Generate reticle and stencil design.
• Generate other schematics or drawing asrequested.
• Review,maintenance and update the design guidelines.
• Manage the conversion of internal design into suppliers’ final design.
• Document all the drawing revisions and change records.
• Support audits
• Any other ad-hoc duties as assigned

Requirement

• Manage packaging design team.
• 5~10years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant.
• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability.
• Familiar with other design software like Link cad, CAM350, AutoCAD, GDS editor and Gerber editors.
• Familiar with PCB test board design.
• Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process will be the advantage.