As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD), you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction, own lab operational excellence and workforce development, ensuring timely, high‑quality results that directly impact critical APTD technical decisions. This role partners closely with Micron's global engineering labs, subject-matter experts and external vendors to expand lab capability, efficiency and ensure forward-looking readiness for new technologies.

Responsibilities and Tasks

 Lab Management, Compliance & Audits

• Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards.

• Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency.

• Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime.

• Evaluate and introduce new FA tool models and capabilities in partnership with vendors and Micron subject‑matter experts.

• Lead various EHS, quality, TS, ISO14001, OHSAS, and customer audits with a strong safety‑first culture.

Technical Leadership & Cross‑Functional Partnership

• Provide technical mentorship and drive continuous improvement of package characterization methodologies and procedures.

• Collaborate cross‑site to benchmark, standardize best-known methods to improve lab efficiency and effectiveness.

• Ensure FA lab readiness for new product designs and technologies.

• Align task priorities and execution with APTD team members, providing recommendations for optimal lab tool/resource usage.

• Deliver timely, clear, and actionable package analysis insights to enable data‑driven technical and business decisions.

Workforce Development & Performance Management

• Build and sustain a robust training and development program, including hands‑on FA casework, cross‑site learning, and leadership mentoring.

• Define, track, and review performance metrics to identify gaps, drive accountability, and build a high‑performing team.

• Provide mentorship, regular coaching, communication and career development for lab engineers and technicians.

Requirements

• Bachelor’s degree or higher (Master’s/PhD preferred) in Materials Science, Physics, Chemistry, or related field.

• 8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis field.

• Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.

• Knowledge of semiconductor or advanced packaging manufacturing processes.

• Experience in lab management, shift resource planning, and budgeting.

• Proven technical leadership and people management capability.

• Strong written and verbal communication skills with a customer‑focused mentality
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.