Position Summary

The NPI Engineer develops new semiconductor assembly processes and qualifies customer products for

manufacturing. This role leads process development for die bonding, wire bonding, and related assembly

activities to ensure each process is robust, repeatable, and ready for manufacturing transfer before production

release.

Key Responsibilities

New Product Introduction (NPI)

• Lead technical development of new customer products through engineering qualification.

• Review customer specifications, drawings, bills of materials, and manufacturing requirements.

• Assess manufacturability and recommend suitable assembly processes.

• Develop the manufacturing flow for new products.

• Define process acceptance criteria and qualification requirements.

Process Development

• Develop and optimize die bonding and wire bonding processes.

• Establish process parameters and operating windows.

• Create machine programs for die bonders and wire bonders.

• Optimize dispensing, curing, plasma cleaning, and other supporting assembly processes.

• Evaluate new materials, tooling, fixtures, and consumables.

Process Validation

• Plan and execute Design of Experiments (DOE) activities.

• Conduct engineering validation builds.

• Analyze process capability and qualification results.

• Define critical process parameters.

• Establish process controls before production release.

Customer Technical Support

• Participate in technical discussions with customers.

• Support Design for Manufacturability reviews.

• Prepare engineering reports and technical presentations.

• Support customer qualification builds and technical audits.

• Provide technical recommendations throughout project development.

Engineering Documentation

• Prepare process specifications.

• Develop machine setup sheets and process recipes.

• Prepare engineering and qualification reports.

• Define preliminary work instructions.

• Support PFMEA and Control Plan development.

Cross-functional Collaboration

• Work closely with Process Engineering during production handover.

• Coordinate with Production Process Engineering to confirm manufacturing readiness.

• Support Quality during qualification activities.

• Coordinate with Purchasing for new material evaluations.

• Work with suppliers on tooling and material development.

Qualifications

• Bachelor’s degree in Mechanical Engineering, Manufacturing Engineering, Materials Engineering, Electrical Engineering, or an equivalent discipline.

• Two to five years of experience in semiconductor assembly or electronics manufacturing.

• Experience in die bonding, eutectic bonding, epoxy die attach, wire bonding, or optical assembly is preferred.

Technical Skills

• Die Bond Process Development

• Wire Bond Process Development

• Machine Programming

• Design of Experiments (DOE)

• Statistical Process Control (SPC)

• Root Cause Analysis

• Process Capability Analysis (Cp/Cpk)

• PFMEA

• Process Validation

• Technical Report Writing

• AutoCAD or SolidWorks experience, particularly for tooling design, is an advantage.

Soft Skills

• Strong analytical and problem-solving skills.

• Good project management skills.

• Customer-focused mindset.

• Excellent communication and presentation skills.

• Ability to manage multiple NPI projects simultaneously.

• Self-motivated and able to work independently.

Key Performance Indicators (KPIs)

• On-time NPI project completion

• First-pass qualification success rate

• Engineering yield achievement

• Customer qualification success

• Process Capability (Cp/Cpk)

• Engineering documentation completion

• Successful transfer to manufacturing

• Customer Satisfaction

• Engineering response time