Lico Resources is partnering with a prominent technology solutions provider renowned for its contributions to the global semiconductor manufacturing sector. This organization is recognized for its cutting-edge innovations in high-precision engineering and advanced packaging systems.

Mechanical Design Engineer – High-Precision Equipment Design

We are seeking a talented mechanical design professional to join a multidisciplinary team responsible for developing precision modules used in advanced packaging applications. This Singapore-based role offers the chance to influence critical aspects of semiconductor equipment design, from concept through to production, within a fast-paced and innovation-driven environment.

Key Responsibilities

• Translate application and performance requirements into robust mechanical design concepts and detailed specifications.
• Conduct force analysis, vibration modeling, thermal simulations, and lifespan estimations to evaluate and optimize design integrity.
• Develop and compare multiple design options, balancing performance, cost-efficiency, and manufacturability.
• Select appropriate materials that meet reliability standards and are compatible with cleanroom manufacturing and semiconductor processes.
• Design high-precision jigs, fixtures, and custom tooling to support advanced microelectronic assembly.
• Create detailed 3D models and perform structural assessments using simulation tools.
• Work in close coordination with process, manufacturing, and test engineering teams to ensure smooth design transfer and manufacturability.
• Drive continuous improvement initiatives by identifying opportunities to enhance product performance, design efficiency, and cost control.
• Adhere to safety, quality, and environmental compliance standards in line with regulatory requirements in Singapore.

Qualifications

Essential:

• Bachelor’s degree or higher in Mechanical Engineering or a closely related discipline.
• Proven experience in mechanical design, ideally within the semiconductor or precision equipment domain.
• Proficient in 3D CAD tools such as Solid Edge, SolidWorks, Pro-E, or AutoCAD.
• Strong grasp of mechanical fundamentals, including stress analysis, thermal behavior, and motion precision.
• Effective problem-solving skills and the ability to manage multiple design iterations in a dynamic environment.

Desirable:

• Familiarity with advanced packaging processes such as wafer-level packaging, 2.5D/3D integration, or flip-chip assembly.
• Exposure to thermal management strategies, vibration damping, or high-precision motion control systems.
• Strong communication and collaboration skills for cross-functional teamwork and technical presentations.

If you are interested in this role, please send us your updated resume today to [email protected] quoting reference number A088451. Please note that only shortlisted candidates will be notified.

"Data provided is for recruitment purposes only."

Job Reference No: A088451
EA Licence No.: 13C6733
EA Registration No.: R1333454