(Semiconductor Tooling Design)

5 days, 8.30am-6.15pm

Salary: $3500- $6000

Location: Ubi 

Company background:

Specializes in Semiconductor Backend Tooling including Die Attach Tools, Wire Bond Tools & Bond Test Tools

Job Responsibilities:

• Design and development of Semiconductor Tools and mechanical systems.
• Planning, Scheduling and Costing of Tools and Mechanical Modules
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with Electrical, Vision and Software Engineers.
• Willing to work extended hours in critical phases of project execution.

Job Requirements:

• Diploma or Degree in Mechanical Engineering or related Technical disciplines.
• Minimum 3 years of design experiences in semiconductor tooling
• Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus
• Proficiency with CAD Software is a must.
• Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage.

Quah Siying (Jeslyn) R1982418

The Supreme HR Advisory Pte Ltd 14C7279