Job Description

• As part of the CNC Machinist group, this position involves development of new manufacturing processes and lean manufacturing practices.
• The role also involves Design tools and fixtures with Autocad and CNC Programming
• To Operate of high Vacuum and Sinter HIP furnace, CNC, Dicing Saw and Precision Waterjet. Support the training of staff and line operators on manufacturing processes.
• Inspection with wide variety of measuring devices, gages, optical equipment as well as develop quality procedures to ensure robust processes.
• Perform preventive maintenance of machines and ensure Work Health and Safety in all processes

Roles & Responsibilities

• Support processes to deposit conductive (metal) films by Plating, PVD Sputtering and Vacuum Evaporation.
• Support film characterization techniques for metrology and inspection
• Perform day-to-day operations of deposition tools - tool and process monitoring, post PM process qualification, troubleshooting
• Work closely with integration and test teams on developing critical to quality (CTQ) metrics, root cause analysis (RCA) and corrective actions for yield improvements

Requirements

• Min. Secondary/ITE-NTEC/Diploma/Degree level PE/ME/Mfg/Mechatronics or related displicine.
• Min. 2 years of experience leading manufacturing processes in at least one of the following fields: semiconductor front or back end such as wafer bumping, dicing, mask design, plating and thin film process development.
• Good analytical, verbal, written and interpersonal skills
• Hands on fabrication: mechanical assembly, mechanical design and manufacturing and mask design.
• Experience working around delicate high-tech equipment.
• Experience in statistical analysis methods and tools, design of experiment
• Understanding of materials characterization and FA techniques
• Good communication and teamwork skills.