Responsibilities;

• Line sustaining for dry process (i.e. Sputter, Photolithography and Descum)
• Support lot dispositions and OCAP executions
• Involve in Continuous Improvement Projects
• Working with QM Dept. to response customer inquires and issues
• Execute CIP or project handling that contributes yield & cost efficiency improvement
• Ensure SPC is maintain and in control
• Support new material evaluation and new tool set up

Requirements;

• Diploma in electronics or related disciplines
• Preferably with minimum 2 years' experience in Wafer bumping process running high volume
• Knowledge in: Statistic Process Control (SPC), Out Of Control Procedure (OCAP)