Application & Process Engineer – Die Bonding (Semiconductor) | Up to $6k / 5 days / Woodlands | 0580
Application & Process Engineer – Die Bonding (Semiconductor) | Up to $6k / 5 days / Woodlands | 0580
Job Details
Vacancies
1 position
Experience Required
No experience required
Job Description
- Working Location: Woodlands North Coast
- Working Days: Monday – Friday
- Working Hours: 9:00am -6:00pm
- Starting Salary: $3,000 to $6,000
Responsibilities
- Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
- Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
- Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
- Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
- Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
- Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
- Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
- Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.
Job Requirement
- Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
- 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
- Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
- Experience with semiconductor equipment integration, motion control systems, and process development.
- Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
- Willingness to travel for customer support and on-site installations (as required).
The Supreme HR Advisory Pte. Ltd || 14C7279
Chua Jie Ying (Cai Jie Ying), Evelynn || EA Personnel License R24120580
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