Key Job Accountabilities:

• Operate MEOL/AOI process equipment such as dielectric deposition, etching, and metallization tools
• Operate plating systems for metal deposition including copper or solder plating
• Monitor equipment performance and process parameters during production
• Perform wafer handling and ensure proper lot movement through production stages
• Identify equipment abnormalities and escalate issues
• Support preventive maintenance and equipment checks
• Maintain operational logs and production documentation

Required Experience and Qualifications:

• Associate degree in Engineering or Semiconductor Technology preferred
• Basic knowledge of electroplating and solder reflow processes used in semiconductor packaging
• Experience operating plating equipment or thermal processing systems preferred
• Familiarity with plating chemistry control and process monitoring is a plus
• Understanding of wafer bumping or solder bump formation processes preferred
• Ability to follow chemical handling procedures and cleanroom safety protocols
• Strong troubleshooting and problem-solving skills in manufacturing environments
• Willingness to work rotating shifts in a semiconductor fabrication or packaging facility