THE SUPREME HR ADVISORY PTE. LTD.

6723 - Senior Process & Applications Engineer & Presales Engineer (TCB | $7K–$10K | Semiconductor)

Location
D01 Marina, Raffles Place, People's Park, Cecil
Job Type
Full-time
Experience
Mid
Category
General
Salary
$7,000 - $12,000
Posted
2 weeks ago
Expires
Jul 10, 2026
Views
4

Job Details

Vacancies

1 position

Experience Required

No experience required

Job Description

Position title : Senior TCB Application & Technical Sales Engineer

Location: Admirax St

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 7,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

  • Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.

  • Support technical sales activities and customer discussions.

  • Benchmark competitor equipment and identify technology gaps.

  • Translate customer requirements into internal equipment specifications.

  • Develop and optimize TCB process parameters on TCB Equipments.

  • Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.

  • Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.

  • Conduct DOE and process characterization activities.

  • Work closely with Mechanical, Software, Electrical, Motion and Vision teams.

  • Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.

  • Lead machine qualification, FAT and SAT activities.

  • Act as the internal customer during machine development.

  • Support customer buyoff and onsite qualification activities.

Requirements:

  • Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.

  • 5–15 years of semiconductor packaging experience preferred.

  • Hands-on experience in TCB, Flip Chip and Advanced Packaging.

  • Experience in HBM / CoWoS / 2.5D / 3D packaging.

  • Experience in OSAT, IDM or semiconductor equipment environments preferred.

  • Experience with fluxless or N2 bonding environment is an advantage.

  • Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.

  • Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.


    📲Interested candidates, please WhatsApp your resume to: +65 9642 0989 (Han) 📧 Or email your resume to: [email protected]

    👤Chaw Chiaw Han | R22106723🏢 The Supreme HR Advisory Pte Ltd | EA 14C7279

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